Papers and Presentations

More than Moore White Paper by the IRC

This white paper proposes a methodology to help the ITRS community identify those More than Moore (MtM) technologies for which a roadmapping effort is feasible and desireable.

Special White Paper Augmenting ITRS Chapters 450 mm
A position paper report submitted by the ITRS Starting Materials Sub-TWG, in June 2005.  This document presents advantages and challenges associated with the introduction of 450mm wafers.  It offers the historical perspective and economic considerations, as well as details of the transisition to 450mm.

Assembly and Packaging White Paper on System Level Integration

System on Chip (SoC) and System in Package (SiP) technologies provide a path for continued improvement in performance, power, cost and size at the system level without relying upon conventional CMOS scaling alone. System in Package (SiP) technology is rapidly evolved from specialty technology used in a narrow set of applications to a high volume technology with wide ranging impact on electronics markets. This paper presents details on requirements, challenges, and applications for SiP.