Papers and Presentations

Special White Paper Augmenting ITRS Chapters 450 mm
A position paper report submitted by the ITRS Starting Materials Sub-TWG, in June 2005.  This document presents advantages and challenges associated with the introduction of 450mm wafers.  It offers the historical perspective and economic considerations, as well as details of the transisition to 450mm.

Assembly and Packaging White Paper on System Level Integration

System on Chip (SoC) and System in Package (SiP) technologies provide a path for continued improvement in performance, power, cost and size at the system level without relying upon conventional CMOS scaling alone. System in Package (SiP) technology is rapidly evolved from specialty technology used in a narrow set of applications to a high volume technology with wide ranging impact on electronics markets. This paper presents details on requirements, challenges, and applications for SiP.

2007 Winter Presentations, ITRS Winter Conference

All the presentations from this public conference are available as part of the 2007 ITRS release.