2009 ITRS Summer Conference Proceedings - July 15, San Francisco
| Overall Roadmap Technology Characteristics -- Alan Allan |
| System Drivers and Design -- Andrew Kahng |
| Test and Test Equipment -- Roger Barth |
| RF & A/MS Technologies for Wireless Communications -- Herb Bennett |
| Process Integration, Devices, & Structures -- Rich Liu |
| Emerging Research Devices -- Jim Hutchby |
| Emerging Research Materials -- Mike Garner |
| Front-end Processes -- Jeff Butterbaugh |
| Lithography -- Greg Hughes |
| Interconnect -- Christopher Case |
| Factory Integration -- Shigeru Kobayashi |
| Assembly and
Packaging -- Bill Bottoms |
| Environment, Safety, and Health -- Jim Jewett |
| Yield Enhancement -- Lothar Pfitzner |
| Metrology -- Alain Diebold |
| Modeling and Simulation -- Jürgen Lorenz |
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| THE FUTURE OF INNOVATION Panel Discussion |
| Greeting by Host and Moderator -- George Scalise, SIA |
| Redefining Mobility -- Mike Campbell, Qualcomm |
| Macro Trends Facing the Semiconductor Industry -- Mark Durcan, Micron |
| Implications of Today's Trends on Tomorrow's Technology -- Douglas Neugold, ATMI |
| Semiconductor Equipment Manufacturing -- Thomas St. Dennis, Applied Materials |
| Supply Chain Meets -- Tien Wu, ASE Group |
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