7:30

Registration and Continental Breakfast

8:00-8:15

ESIA

JEITA

KSIA

TSIA

SIA

Opening Remarks & Orientation

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8:15 – Session 1 Greetings by Europe IRC

8:15-8:35

8:35-8:55

8:55-9:15

9:15-9:35

9:35-9:45

9:45-10:00

Overall Roadmap Technology Characteristics

Process Integration, Devices, and Strucs.

Emerging Research Materials

Emerging Research Devices

Q&A

Break and Poster Review

10:00 – Session 2 Greetings by Japan IRC

10:00-10:20

10:20-10:40

10:40-11:00

11:00-11:20

11:20-11:30

11:30-13:00

13:00 – 14:00

RF and A/MS Technologies for Wireless Comm.

Metrology

Environment, Safety, and Health 

Front End Processes

Q & A

Lunch

More than Moore presentation/panel discussion chaired by Paolo Gargini

14:00 – Session 3 Greetings by US IRC

14:00-14:20

14:20-14:50

14:50-15:10

15:10-15:30

15:30-15:40

15:40-16:00

Test & Test Equipment 

System Drivers and Design

Interconnect

Factory Integration

Q & A

Break and Poster Review

16:00 – Session 4 Greetings by Taiwan IRC

16:00-16:20

16:20-16:40

16:40-17:00

17:00-17:20

17:20-17:30

17:30-17:45

17:45-19:00

Yield Enhancement

Lithography

Modeling and Simulation

Assembly and Packaging

Q & A

Open Discussion & Closing Remarks

ITRS Networking Social