Papers and Presentations

Catrene Scientific Committee Report "Towards a More-than-Moore Roadmap"

“More-than-Moore” (or MtM) is the other facet of the microelectronic products complementing the digital part of the integrated systems. More specifically the “More-than-Moore” approach allows for the non-digital functionalities of a product – which do not necessarily scale according to “Moore's Law”, but provide additional value in different ways – to migrate from the system board-level into the package (SiP) or onto the chip (SoC). This report issued by a Working Group of the CATRENE Scientific Committee is aimed to stimulate a broad roadmapping effort in the “More-than-Moore” domain as successfully as it is done in the ITRS for its digital counterpart.
This report is provided to the ITWGs as pre-reading for the More-than-Moore Workshop on April 13, 2011.
Please Note: DO NOT DISTRIBUTE OR PUBLISH!

Special White Paper Augmenting ITRS Chapters 450 mm

A position paper report submitted by the ITRS Starting Materials Sub-TWG, in June 2005.  This document presents advantages and challenges associated with the introduction of 450mm wafers.  It offers the historical perspective and economic considerations, as well as details of the transisition to 450mm.

Assembly and Packaging White Paper on System Level Integration

System on Chip (SoC) and System in Package (SiP) technologies provide a path for continued improvement in performance, power, cost and size at the system level without relying upon conventional CMOS scaling alone. System in Package (SiP) technology is rapidly evolved from specialty technology used in a narrow set of applications to a high volume technology with wide ranging impact on electronics markets. This paper presents details on requirements, challenges, and applications for SiP.

ITRS – Networking and Microprocessor (MPU) Driver White Paper

As technologies and structures push the limits of Moore’s law and productivity, the ITRS 15-year assessment of the semiconductor industry technology requirements and potential solutions indicates new approaches to maintain scaling and introducing functionality on- and off-chip.

2007 Winter Presentations, ITRS Winter Conference

All the presentations from this public conference are available as part of the 2007 ITRS release.